Company Filing History:
1 out of 4 
1 out of 8 Years Active: 2001-2003
Title: Innovations by Ee Chang Ong
Introduction
Ee Chang Ong is an accomplished inventor based in Cupertino, CA. He has made significant contributions to the field of integrated circuit technology, holding a total of 2 patents. His work focuses on enhancing the performance and efficiency of semiconductor devices.
Latest Patents
One of his latest patents is titled "Method and apparatus for reducing IC die mass and thickness while improving strength characteristics." This invention involves a method for decreasing the mass and increasing the strength of an IC wafer assembly. It includes adding a polymer coating to the frontside of the wafer assembly to protect and strengthen it, while also removing silicon material from the backside to reduce the overall thickness. The removal can be achieved through backgrinding or other techniques, sometimes reducing the thickness to less than that of the polymer coating.
Another notable patent is "Method and apparatus for enhancement of a punch guide/receptor tool in a dambar removal system." This invention features a punch guide/receptacle for a dambar-removal tool set, which includes a mounting fixture and an insert designed to fit an adaptive region of the mounting fixture. The insert contains apertures for punch teeth, and it can be removed and repaired as needed. In one embodiment, the insert has both upper and lower rows of apertures, allowing for repair by simply reversing the insert in the mounting block.
Career Highlights
Throughout his career, Ee Chang Ong has worked with several companies, including Advanced Interconnect Solutions and Integrated Packaging Assembly Corporation. His experience in these organizations has contributed to his expertise in the semiconductor industry.
Collaborations
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Conclusion
Ee Chang Ong's innovative patents and career achievements highlight his significant impact on the field of integrated circuit technology. His work continues to influence advancements in semiconductor design and manufacturing.