The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Sep. 13, 2000
Method and apparatus for reducing ic die mass and thickness while improving strength characteristics
Applicant:
Inventor:
Ee Chang Ong, Cupertino, CA (US);
Assignee:
Advanced Interconnect Solutions, Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H07L 2/131 ;
U.S. Cl.
CPC ...
H07L 2/131 ;
Abstract
A method for decreasing the mass and increasing the strength of an IC wafer assembly involves adding a polymer coating to the frontside of the wafer assembly to protect and strengthen the assembly, and removing silicon material from the backside of the wafer assembly, reducing the overall thickness of the assembly. The removal can be by backgrinding or by many other removal techniques, and in some cases is removed to a thickness less than that of the polymer coating.