Company Filing History:
Years Active: 1995-1996
Title: Victor Batinovich: Innovator in Semiconductor Packaging
Introduction
Victor Batinovich is a notable inventor based in Morgan Hill, CA (US). He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
One of Victor's latest patents is for a metal semiconductor package with an external plastic seal. This improved semiconductor package features a lead frame with both a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame, while bond wires electrically couple the lead frame to the semiconductor die. A metallic base is located at the bottom side of the lead frame, and a metallic cap is positioned over the top side. The metallic cap includes a central aperture that aligns with the semiconductor die. An external plastic seal is utilized to join the metallic base, lead frame, and metallic cap, which may take the form of either a perimeter seal or a body seal.
Career Highlights
Victor Batinovich is currently employed at Integrated Packaging Assembly Corporation, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.
Collaborations
Victor collaborates with Gerald K. Fehr, contributing to the innovative projects at their company.
Conclusion
Victor Batinovich's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.