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For the Inventor, By the Inventor

Clinton, NY, United States of America

Indium Corporation


USPTO Granted Patents = 42


Forward Citations = 71

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38 inventors (with patents filed for the assignee):

goldMedal Ning-Cheng Lee (27 out of 32 patents)

silverMedal Hongwen Zhang (12 out of 12 patents)

bronzeMedal Weiping Liu (6 out of 6 patents)

4.  Ross B Berntson (6 out of 6 patents)

5.  Robert N Jarrett (5 out of 6 patents)

6.  Jordan P Ross (5 out of 5 patents)

7.  Francis M Mutuku (5 out of 5 patents)

8.  Fen Chen (4 out of 4 patents)

9.  Jie Geng (4 out of 4 patents)

10.  James E Hisert (4 out of 5 patents)

11.  Sihai Chen (4 out of 4 patents)

12.  David P Socha (4 out of 4 patents)

13.  Amanda Hartnett (3 out of 3 patents)

14.  Anthony D Lanza, Jr (2 out of 2 patents)

15.  Elaina J Zito (2 out of 2 patents)


Core Competencies:
Liquid Metal Thermal Interface
Lead-Free Solder Alloys
Thermal Interface Bond
3D Printing Build Plate
Tin-Indium Solder Alloys
Hybrid Lead-Free Solder Wire
Thermal Conduction Enhancement
Solder Paste Formulations
High Temperature Applications
Low Void Solder Joints
Metal Coating Techniques
Heat Dissipating Paint

42 patents:

1. 12451402 - Liquid metal thermal interface (2025-10-21),
2. 12300567 - Solid metal foam thermal interface material (2025-05-13),
3. 12240060 - SnIn solder alloys (2025-03-04),
4. 12090579 - High reliability lead-free solder alloys for harsh environment electronics applications (2024-09-17),
5. 12042864 - Thermally decomposing build plate with casting mold for facile release of 3D printed objects (2024-07-23),
6. 12023735 - Thermally decomposable build plate structure for stabilization of metal build surface during 3D printing and facile release of 3D printed objects (2024-07-02),
7. 11999018 - SnBi and SnIn solder alloys (2024-06-04),
8. 11807536 - Method for preparing graphite sheets with piercing treatment to enhance thermal conduction (2023-11-07),
9. 11766721 - Thermally decomposing build plate for facile release of 3D printed objects (2023-09-26),
10. 11752579 - High reliability leadfree solder alloys for harsh service conditions (2023-09-12),
11. 11738411 - Lead-free solder paste with mixed solder powders for high temperature applications (2023-08-29),
12. 11712762 - Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders (2023-08-01),
13. 11602808 - Solder preform with internal flux core including thermochromic indicator (2023-03-14),
14. 11581239 - Lead-free solder paste as thermal interface material (2023-02-14),
15. 11413709 - High reliability lead-free solder alloys for harsh environment electronics applications (2022-08-16),
Indium Corporation is a global materials supplier headquartered in the USA. They provide a wide range of products and services, including soldering materials, thermal interface materials, and semiconductor packaging materials. Their expertise lies in developing and manufacturing reliable materials for various industries such as automotive, aerospace, and electronics. With a commitment to quality and innovation, Indium Corporation aims to consistently meet customer needs and exceed their expectations.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 23 2025

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42 Patents

#1 in Clinton, NY

#459 in New York

#7,979 in US

#15,855 in the World

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Clinton, NY, United States of America

Indium Corporation

Forward Citations = 71

38 inventors:

goldMedal Ning-Cheng Lee (27 out of 32 patents)

silverMedal Hongwen Zhang (12 out of 12 patents)

bronzeMedal Weiping Liu (6 out of 6 patents)

4.  Ross B Berntson (6 out of 6 patents)

5.  Robert N Jarrett (5 out of 6 patents)

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