For the Inventor, By the Inventor

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Utica, NY, United States of America

Indium Corporation

USPTO Granted Patents = 43

EPO Patents = 6

Forward Citations = 80

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38 inventors (with patents filed for the assignee):

Ning-Cheng Lee (27 out of 32 patents)

Hongwen Zhang (12 out of 12 patents)

Weiping Liu (6 out of 6 patents)

4. Ross B Berntson (6 out of 6 patents)

5. Robert N Jarrett (5 out of 6 patents)

6. Jordan P Ross (5 out of 5 patents)

7. Francis M Mutuku (5 out of 5 patents)

8. Fen Chen (4 out of 4 patents)

9. Jie Geng (4 out of 4 patents)

10. James E Hisert (4 out of 5 patents)

11. Sihai Chen (4 out of 4 patents)

12. David P Socha (4 out of 4 patents)

13. Anthony D Lanza, Jr (3 out of 3 patents)

14. Amanda Hartnett (3 out of 3 patents)

15. Craig K Merritt (3 out of 4 patents)

Core Competencies:

Lead-Free Solder

Thermal Interface

3D Printing

Low Void Solder

Solder Alloys

Thermal Conduction

Semiconductor Assembly

Fluxes

High Reliability

Thermal Management

Metal Coating

Mixed Alloy

43 patents: Sort by Forward Citations

1. 12521821 - Solder preform with internal flux core including thermochromic indicator (2026-01-13),

2. 12451402 - Liquid metal thermal interface (2025-10-21),

3. 12300567 - Solid metal foam thermal interface material (2025-05-13),

4. 12240060 - SnIn solder alloys (2025-03-04),

5. 12090579 - High reliability lead-free solder alloys for harsh environment electronics applications (2024-09-17),

6. 12042864 - Thermally decomposing build plate with casting mold for facile release of 3D printed objects (2024-07-23),

7. 12023735 - Thermally decomposable build plate structure for stabilization of metal build surface during 3D printing and facile release of 3D printed objects (2024-07-02),

8. 11999018 - SnBi and SnIn solder alloys (2024-06-04),

9. 11807536 - Method for preparing graphite sheets with piercing treatment to enhance thermal conduction (2023-11-07),

10. 11766721 - Thermally decomposing build plate for facile release of 3D printed objects (2023-09-26),

11. 11752579 - High reliability leadfree solder alloys for harsh service conditions (2023-09-12),

12. 11738411 - Lead-free solder paste with mixed solder powders for high temperature applications (2023-08-29),

13. 11712762 - Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders (2023-08-01),

14. 11602808 - Solder preform with internal flux core including thermochromic indicator (2023-03-14),

15. 11581239 - Lead-free solder paste as thermal interface material (2023-02-14),

Indium Corporation, headquartered in Utica, NY, specializes in advanced materials for electronics assembly and semiconductor packaging. The company focuses on developing innovative solutions such as liquid metal thermal interfaces, lead-free solder alloys, and thermal interface bonds. Their expertise extends to 3D printing technologies and solder paste formulations, enhancing thermal conduction and reliability in various applications. Indium Corporation is committed to providing high-performance materials that meet the evolving needs of the electronics industry.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

Indium Corporation

43 Patents

#2 in Utica, NY

#497 in New York

#8,084 in US

#16,010 in the World

Utica, NY, United States of America

Indium Corporation

Forward Citations = 80

38 inventors:

Ning-Cheng Lee (27 out of 32 patents)

Hongwen Zhang (12 out of 12 patents)

Weiping Liu (6 out of 6 patents)

4. Ross B Berntson (6 out of 6 patents)

5. Robert N Jarrett (5 out of 6 patents)

Please report any incorrect information to [email protected]

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