The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

May. 18, 2022
Applicant:

Indium Corporation, Utica, NY (US);

Inventors:

Ross B. Berntson, New Hartford, NY (US);

David P. Socha, Whitesboro, NY (US);

Assignee:

INDIUM CORPORATION, Utica, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); G01R 31/28 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3733 (2013.01); H01L 21/4882 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 24/29 (2013.01); G01R 31/2874 (2013.01); H01L 23/42 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29205 (2013.01); H01L 2224/29209 (2013.01); H01L 2224/29305 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32502 (2013.01); H01L 2224/32506 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83805 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/0134 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/16598 (2013.01);
Abstract

Solid metal foam thermal interface materials and their uses in electronics assembly are described. In one implementation, a method includes: applying a thermal interface material (TIM) between a first device and a second device to form an assembly having a first surface of the TIM in in touching relation with a surface of the first device, and a second surface of the TIM opposite the first surface in touching relation with a surface of the second device, the TIM comprising a solid metal foam and a first liquid metal; and compressing the assembly to form an alloy from the TIM that bonds the first device to the second device.


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