Robert N Jarrett

This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignees: Indium Corporation, Indium Corporation of America. Active years: 2009-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert N Jarrett. Retrieved from https://idiyas.com/inventor/robert-n-jarrett

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 28(Granted Patents)

Location History:

Clinton, NY (US) (2009 - 2016)
Utica, NY (US) (2020 - 2021)

Company Filing History:

Indium Corporation of America

patents

Years Active: 2009-2021

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10943796 - Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger (2021-03-09),

2. 10943795 - Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger (2021-03-09),

3. 10838002 - Burn-in preform and method of making the same (2020-11-17),

4. 10607857 - Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger (2020-03-31),

5. 9468136 - Low void solder joint for multiple reflow applications (2016-10-11),

6. 7593228 - Technique for forming a thermally conductive interface with patterned metal foil (2009-09-22),

Title: The Innovations of Robert N. Jarrett

Introduction

Robert N. Jarrett is a notable inventor based in Utica, NY, with a significant contribution to the field of semiconductor technology. He holds a total of six patents, showcasing his expertise and innovative spirit in developing advanced semiconductor device assemblies.

Latest Patents

Among his latest patents is a semiconductor device assembly that features a thermal interface bond between a semiconductor die and a passive heat exchanger. This invention includes a semiconductor device, a heat exchanger, and a thermal interface material. The thermal interface material is designed to contact a facing surface of the heat exchanger and comprises alloys that react with a bond-enhancing agent to form an indium alloy layer. Another notable patent involves methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger. This method includes applying a bond-enhancing agent to a semiconductor device and creating an assembly that ensures effective thermal bonding.

Career Highlights

Throughout his career, Robert N. Jarrett has worked with prominent companies such as Indium Corporation and Indium Corporation of America. His work has significantly impacted the semiconductor industry, particularly in enhancing thermal management solutions.

Collaborations

Robert has collaborated with notable colleagues, including Jordan P. Ross and Ross B. Berntson, contributing to various innovative projects in the semiconductor field.

Conclusion

Robert N. Jarrett's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in thermal interface materials and semiconductor device assemblies.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: