The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Oct. 30, 2018
Indium Corporation, Utica, NY (US);
Thomas R. Gross, Utica, NY (US);
Robert Jarrett, Utica, NY (US);
Anthony D. Lanza, Jr., Utica, NY (US);
Craig K. Merritt, Utica, NY (US);
INDIUM CORPORATION, Utica, NY (US);
Abstract
Some implementations are directed to a burn-in solder preform including: a barrier layer to prevent thermally conductive material from adhering to a semiconductor component during burn-in testing; and a thermally conductive cladding layer attached to a portion of the barrier layer such that at least one dimension of the barrier layer extends past the thermally conductive cladding layer, where the thermally conductive cladding layer is attached over the barrier layer through continuous attachment or spot attachment. In some implementations, a method includes: placing the aforementioned burn-in solder preform between a test fixture and a semiconductor component; attaching a portion of the barrier layer of the burn-in solder preform to a head of the text fixture; and after attaching a portion of the barrier layer of the burn-in solder preform to the head of the test fixture, performing burn-in testing of the semiconductor component.