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Utica, NY, United States of America

Indium Corporation of America

USPTO Granted Patents = 26

Trademarks = 64

Forward Citations = 240

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35 inventors (with patents filed for the assignee):

James A Slattery (6 out of 7 patents)

Ning-Cheng Lee (5 out of 32 patents)

Paul A Socha (5 out of 5 patents)

4. Charles E White (5 out of 5 patents)

5. Ian Tevis (3 out of 15 patents)

6. Benlih Huang (3 out of 3 patents)

7. Martin Thuo (3 out of 26 patents)

8. Hong-Sik Hwang (2 out of 2 patents)

9. Laurence G Stevens (2 out of 2 patents)

10. John R Sovinsky (2 out of 2 patents)

11. Christophe Frankiewicz (1 out of 5 patents)

12. Michael V Brown (1 out of 6 patents)

13. Robert N Jarrett (1 out of 6 patents)

14. Ellen Heian (1 out of 3 patents)

15. Timothy Ryan Rude (1 out of 6 patents)

26 patents: Sort by Forward Citations

1. 12226831 - Direct printing and writing using undercooled metallic core-shell particles (2025-02-18),

2. 12208471 - Solder materials including supercooled micro-capsules and alloyed particles (2025-01-28),

3. 12030126 - Undercooled liquid metallic droplets having a protective shell (2024-07-09),

4. 7749340 - Technique for increasing the compliance of lead-free solders containing silver (2010-07-06),

5. 7749336 - Technique for increasing the compliance of tin-indium solders (2010-07-06),

6. 7635076 - Method for fabricating large dimension bonds using reactive multilayer joining (2009-12-22),

7. 7593228 - Technique for forming a thermally conductive interface with patterned metal foil (2009-09-22),

8. 7017795 - Solder pastes for providing high elasticity, low rigidity solder joints (2006-03-28),

9. 6783057 - Anti-tombstoning solder alloys for surface mount applications (2004-08-31),

10. 6677179 - Method of applying no-flow underfill (2004-01-13),

11. 6610559 - Integrated void-free process for assembling a solder bumped chip (2003-08-26),

12. 6059900 - Lead-based solders for high temperature applications (2000-05-09),

13. 5957364 - Integrated solder preform array having a tin outer coating (1999-09-28),

14. 5600102 - Solder preform wrappable around a printed circuit card edge (1997-02-04),

15. 5580520 - Lead-free alloy containing tin, silver and indium (1996-12-03),

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, and related industries. With a commitment to quality, innovation, and customer support, Indium Corporation offers a range of high-performance materials, including solders, fluxes, thermal interface materials, and more. With over 85 years of experience, Indium Corporation continues to be a trusted partner for advanced technology solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

26 Patents

#3 in Utica, NY

#697 in New York

#12,424 in US

#24,051 in the World

Utica, NY, United States of America

Indium Corporation of America

Forward Citations = 240

35 inventors:

James A Slattery (6 out of 7 patents)

Ning-Cheng Lee (5 out of 32 patents)

Paul A Socha (5 out of 5 patents)

4. Charles E White (5 out of 5 patents)

5. Ian Tevis (3 out of 15 patents)

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