Jie Geng

Title: Innovations by Jie Geng in Lead-Free Solder Alloys

Introduction

Jie Geng is a notable inventor based in Utica, NY, who has made significant contributions to the field of solder alloys. With a total of four patents to his name, Geng's work focuses on developing high reliability lead-free solder alloys suitable for harsh service conditions. His innovations are crucial for enhancing the performance and reliability of electronic components.

Latest Patents

Geng's latest patents include the development of high reliability lead-free solder alloys designed for extreme conditions. One of his notable inventions details a solder alloy comprising 2.5-4.0 wt % Ag, 0.4-0.8 wt % Cu, 5.0-9.0 wt % Sb, 1.5-3.5 wt % Bi, 0.05-0.35 wt % Ni, with the remainder being Sn. This alloy is utilized in various applications, including components with a main ceramic body and electrodes, as well as in light-emitting diode (LED) components coupled with Metal Core Printed Circuit Boards (MCPCB). Additionally, Geng has developed a lead-free solder paste that incorporates mixed solder powders, making it particularly effective for high-temperature soldering applications.

Career Highlights

Jie Geng is currently employed at Indium Corporation, where he continues to innovate in the field of solder materials. His work has been instrumental in advancing the technology behind lead-free soldering, which is increasingly important in the electronics industry due to environmental regulations and the demand for sustainable practices.

Collaborations

Geng has collaborated with esteemed colleagues such as Hongwen Zhang and Ning-Cheng Lee, contributing to the advancement of solder technology through shared expertise and innovative ideas.

Conclusion

Jie Geng's contributions to the field of solder alloys exemplify the importance of innovation in electronics. His patents reflect a commitment to developing reliable and environmentally friendly solutions for the industry.