Company Filing History:
Years Active: 2015-2023
Title: Innovations of Sihai Chen in Thermal Interface Materials
Introduction
Sihai Chen is an accomplished inventor based in New Hartford, NY (US). He has made significant contributions to the field of thermal interface materials, holding a total of four patents. His work focuses on developing advanced materials that enhance thermal conductivity and stability in various applications.
Latest Patents
One of Sihai Chen's latest patents is for a lead-free solder paste designed as a thermal interface material. This innovation involves applying a solder paste between a heat-generating device and a heat-transferring device to create an effective thermal interface. The solder paste consists of a solder powder, high melting temperature particles, and flux, with a specific volume ratio to optimize performance. Another notable patent is for a nanomicrocrystallite paste intended for pressureless sintering. This paste includes solvent and nanomicrocrystallite particles, which are crucial for forming low porosity joints with high bond strength and excellent electrical and thermal conductivity.
Career Highlights
Sihai Chen is currently employed at Indium Corporation, where he continues to innovate in the field of thermal materials. His expertise and dedication have led to advancements that benefit various industries, particularly in electronics and thermal management.
Collaborations
Sihai Chen has collaborated with notable colleagues, including Ning-Cheng Lee and Runsheng Mao. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Sihai Chen's contributions to thermal interface materials exemplify the impact of innovative thinking in engineering. His patents reflect a commitment to enhancing the performance and reliability of thermal management solutions.