The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Apr. 29, 2016
Applicant:
Indium Corporation, Clinton, NY (US);
Inventors:
Sihai Chen, New Hartford, NY (US);
Ning-Cheng Lee, New Hartford, NY (US);
Assignee:
Indium Corporation, Utica, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/29169 (2013.01); H01L 2224/29173 (2013.01); H01L 2224/29176 (2013.01); H01L 2224/29178 (2013.01); H01L 2224/29563 (2013.01); H01L 2224/8302 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83095 (2013.01);
Abstract
A sintering paste includes solvent and nanomicrocrystallite (NMC) particles. Each NMC particle is a single crystallite having at least one dimension in the range of 1 nm to 100 nm and at least one dimension in the range of 0.1 μm to 1000 μm. The sintering paste may be used in a pressureless sintering process to form a low porosity joint having high bond strength, high electrical and thermal conductivity, and high thermal stability.