This inventor holds 32 USPTO granted patents and 9 published patent applications and 4 EPO patents, primarily in Lead-Free Solder Alloys. Top assignees: Indium Corporation, Indium Corporation of America. Active years: 2003-2025.
Location History:
- New York, NY (US) (2020)
- New Hartford, NY (US) (2003 - 2023)
- Utica, NY (US) (2020 - 2024)
Company Filing History:
Years Active: 2003-2025
Areas of Expertise:
Title: Ning-Cheng Lee – Innovator in Solder Alloy Technologies
Introduction
Ning-Cheng Lee, a distinguished inventor based in New Hartford, NY, has made significant contributions to the field of electronic solder materials. With a remarkable portfolio of 31 patents, Lee's work focuses on developing advanced solder alloys that enhance the reliability of electronic assemblies in demanding environments.
Latest Patents
Among Ning-Cheng Lee's latest innovations are two notable patents pertaining to high-performance solder alloys. One patent introduces high reliability lead-free solder alloys designed for harsh environment electronics applications. This SnAgCuSbBi-based Pb-free solder alloy is particularly suitable for producing solder joints in various forms, including solder preforms, balls, powder, and paste.
Another patent focuses on low melting temperature SnBi and SnIn solder alloys. The SnBi solder alloy consists of 2 to 60 wt % bismuth (Bi) with additional optional components, while the SnIn solder alloy encompasses 8 to 20 wt % indium (In), alongside other materials. These innovations cater to applications requiring reliable soldering at lower temperatures.
Career Highlights
Ning-Cheng Lee has built his career at renowned institutions like Indium Corporation and Indium Corporation of America. His expertise in solder alloys has not only advanced the company's technology but also contributed to the wider electronics community.
Collaborations
Throughout his career, Lee has collaborated with notable coworkers such as Hongwen Zhang and Weiping Liu. These partnerships have fostered innovation and growth within the solder alloy sector, enabling the sharing of ideas and techniques to push the boundaries of current technologies.
Conclusion
Ning-Cheng Lee's dedication to developing high reliability solder materials has positioned him as a key figure in the field of electronics. His 31 patents reflect a commitment to innovation and excellence in creating solder solutions that meet the needs of modern electronics. As the industry continues to evolve, Lee's contributions will undoubtedly play a pivotal role in advancing electronic assembly technologies.