The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Jun. 19, 2019
Applicant:
Indium Corporation, Utica, NY (US);
Inventors:
Assignee:
INDIUM CORPORATION, Utica, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/14 (2006.01); H05K 3/30 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); H05K 1/0201 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H05K 3/321 (2013.01); H05K 3/3436 (2013.01); H05K 3/3494 (2013.01); H05K 3/42 (2013.01); H05K 2201/09572 (2013.01); H05K 2201/10734 (2013.01);
Abstract
Implementations of the disclosure describe techniques for eliminating or reducing hot tearing in via-in-pad plated over (VIPPO) solder joints by incorporating an adhesive into a printed circuit board assembly (PCBA). In an embodiment, the adhesive is an adhesive containing fluxing agent that prevents tearing by reducing a differential in thermal expansion caused by a coefficient of thermal expansion (CTE) mismatch between a plated metal of the VIPPO pads and the PCB substrate.