Company Filing History:
Years Active: 2020
Title: Innovations by Lee C Kresge in Solder Joint Technology
Introduction
Lee C Kresge is an accomplished inventor based in Utica, NY (US). He has made significant contributions to the field of solder joint technology, particularly in the area of printed circuit board assemblies. His innovative approach addresses critical issues in electronic manufacturing.
Latest Patents
Kresge holds a patent titled "Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material." This patent focuses on techniques for eliminating or reducing hot tearing in via-in-pad plated over (VIPPO) solder joints. The implementation involves incorporating an adhesive into a printed circuit board assembly (PCBA). The adhesive contains a fluxing agent that mitigates tearing by addressing the differential in thermal expansion caused by a coefficient of thermal expansion (CTE) mismatch between the plated metal of the VIPPO pads and the PCB substrate. He has 1 patent to his name.
Career Highlights
Kresge is associated with Indium Corporation, where he applies his expertise in solder joint technology. His work has been instrumental in advancing the reliability and performance of electronic components.
Collaborations
Some of his notable coworkers include Elaina J Zito and Ning-Cheng Lee, who contribute to the innovative environment at Indium Corporation.
Conclusion
Lee C Kresge's contributions to solder joint technology exemplify the importance of innovation in the electronics industry. His patent addresses critical challenges and enhances the reliability of electronic assemblies.