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Sunnyvale, CA, United States of America

High Connection Density Inc.

USPTO Granted Patents = 26

Trademarks = 2

Forward Citations = 861

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19 inventors (with patents filed for the assignee):

Che-Yu Li (24 out of 43 patents)

Zhineng Fan (15 out of 15 patents)

Ai D Le (9 out of 9 patents)

4. Sharon Laura Moriarty (4 out of 4 patents)

5. Dirk Dewar Brown (3 out of 38 patents)

6. Matti A Korhonen (2 out of 4 patents)

7. Linh Van (2 out of 2 patents)

8. David A Lysack (2 out of 2 patents)

9. Thomas L Sly (2 out of 5 patents)

10. Weimin Shi (2 out of 3 patents)

11. Brian David Harry (1 out of 2 patents)

12. John David Williams (1 out of 17 patents)

13. Hassan O Ali (1 out of 5 patents)

14. Douglas E Cote (1 out of 1 patent)

15. Zineng Fan (1 out of 1 patent)

26 patents: Sort by Forward Citations

1. 6846184 - Low inductance electrical contacts and LGA connector system (2005-01-25),

2. 6742426 - Precision cutter for elastomeric cable (2004-06-01),

3. 6723927 - High-reliability interposer for low cost and high reliability applications (2004-04-20),

4. 6722893 - Test and burn-in connector (2004-04-20),

5. 6712621 - Thermally enhanced interposer and method (2004-03-30),

6. 6712620 - Coaxial elastomeric connector system (2004-03-30),

7. 6705877 - Stackable memory module with variable bandwidth (2004-03-16),

8. 6663399 - Surface mount attachable land grid array connector and method of forming same (2003-12-16),

9. 6661690 - High capacity memory module with built-in performance enhancing features (2003-12-09),

10. 6659778 - Contact assembly for land grid array interposer or electrical connector (2003-12-09),

11. 6638077 - Shielded carrier with components for land grid array connectors (2003-10-28),

12. 6597062 - Short channel, memory module with stacked printed circuit boards (2003-07-22),

13. 6590159 - Compact stacked electronic package (2003-07-08),

14. 6551112 - Test and burn-in connector (2003-04-22),

15. 6546625 - Method of forming a contact member cable (2003-04-15),

High Connection Density Inc. is a leading technology company specializing in creating innovative solutions for high-density network connectivity. With a team of experienced engineers, we design and manufacture cutting-edge products that provide exceptional performance and reliability. Our solutions cater to various industries such as telecommunications, data centers, and cloud computing, enabling seamless and efficient data transmission. Visit our website to explore our product offerings and learn how High Connection Density can help you achieve superior connectivity.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

26 Patents

#120 in Sunnyvale, CA

#2,957 in California

#12,430 in US

#24,071 in the World

Sunnyvale, CA, United States of America

High Connection Density Inc.

Forward Citations = 861

19 inventors:

Che-Yu Li (24 out of 43 patents)

Zhineng Fan (15 out of 15 patents)

Ai D Le (9 out of 9 patents)

4. Sharon Laura Moriarty (4 out of 4 patents)

5. Dirk Dewar Brown (3 out of 38 patents)

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