For the Inventor, By the Inventor

Enter assignee name

Sunnyvale, CA, United States of America

High Connection Density Inc.

USPTO Granted Patents = 26

Trademarks = 2

Forward Citations = 862

Loading Chart...

Loading Chart...

19 inventors (with patents filed for the assignee):

Che-Yu Li (24 out of 43 patents)

Zhineng Fan (15 out of 15 patents)

Ai D Le (9 out of 9 patents)

4. Sharon Laura Moriarty (4 out of 4 patents)

5. Dirk Dewar Brown (3 out of 38 patents)

6. Matti A Korhonen (2 out of 4 patents)

7. Linh Van (2 out of 2 patents)

8. David A Lysack (2 out of 2 patents)

9. Thomas L Sly (2 out of 5 patents)

10. Weimin Shi (2 out of 3 patents)

11. Brian David Harry (1 out of 2 patents)

12. John David Williams (1 out of 17 patents)

13. Hassan O Ali (1 out of 5 patents)

14. Douglas E Cote (1 out of 1 patent)

15. Zineng Fan (1 out of 1 patent)

Core Competencies:

Electrical Contacts

LGA Connector

Memory Module

Interposer

Thermal Management

Coaxial Connector

High Frequency

Stacked Modules

Performance Enhancements

Shielded Carrier

Low Inductance

Elastomeric Cable

26 patents: Sort by Forward Citations

1. 6846184 - Low inductance electrical contacts and LGA connector system (2005-01-25),

2. 6742426 - Precision cutter for elastomeric cable (2004-06-01),

3. 6723927 - High-reliability interposer for low cost and high reliability applications (2004-04-20),

4. 6722893 - Test and burn-in connector (2004-04-20),

5. 6712621 - Thermally enhanced interposer and method (2004-03-30),

6. 6712620 - Coaxial elastomeric connector system (2004-03-30),

7. 6705877 - Stackable memory module with variable bandwidth (2004-03-16),

8. 6663399 - Surface mount attachable land grid array connector and method of forming same (2003-12-16),

9. 6661690 - High capacity memory module with built-in performance enhancing features (2003-12-09),

10. 6659778 - Contact assembly for land grid array interposer or electrical connector (2003-12-09),

11. 6638077 - Shielded carrier with components for land grid array connectors (2003-10-28),

12. 6597062 - Short channel, memory module with stacked printed circuit boards (2003-07-22),

13. 6590159 - Compact stacked electronic package (2003-07-08),

14. 6551112 - Test and burn-in connector (2003-04-22),

15. 6546625 - Method of forming a contact member cable (2003-04-15),

High Connection Density Inc. is a technology company based in Sunnyvale, California, specializing in advanced connectivity solutions. The organization focuses on developing innovative products and systems that enhance communication and data transfer capabilities across various platforms. Their expertise spans multiple domains, including telecommunications and networking technologies, aiming to address the growing demands for high-performance connectivity in both consumer and industrial applications.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

26 Patents

#152 in Sunnyvale, CA

#3,038 in California

#12,843 in US

#24,758 in the World

Sunnyvale, CA, United States of America

High Connection Density Inc.

Forward Citations = 862

19 inventors:

Che-Yu Li (24 out of 43 patents)

Zhineng Fan (15 out of 15 patents)

Ai D Le (9 out of 9 patents)

4. Sharon Laura Moriarty (4 out of 4 patents)

5. Dirk Dewar Brown (3 out of 38 patents)

Please report any incorrect information to [email protected]

Loading…