For the Inventor, By the Inventor

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Sunnyvale, CA, United States of America

High Connection Density Inc.

USPTO Granted Patents = 26

Trademarks = 2

Forward Citations = 862

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19 inventors (with patents filed for the assignee):

Che-Yu Li (24 out of 43 patents)

Zhineng Fan (15 out of 15 patents)

Ai D Le (9 out of 9 patents)

4. Sharon Laura Moriarty (4 out of 4 patents)

5. Dirk Dewar Brown (3 out of 38 patents)

6. Matti A Korhonen (2 out of 4 patents)

7. Linh Van (2 out of 2 patents)

8. David A Lysack (2 out of 2 patents)

9. Thomas L Sly (2 out of 5 patents)

10. Weimin Shi (2 out of 3 patents)

11. Brian David Harry (1 out of 2 patents)

12. John David Williams (1 out of 17 patents)

13. Hassan O Ali (1 out of 5 patents)

14. Douglas E Cote (1 out of 1 patent)

15. Zineng Fan (1 out of 1 patent)

Core Competencies:

Electrical Contacts

LGA Connector

Memory Module

Interposer

Thermal Management

Coaxial Connector

High Frequency

Stacked Modules

Performance Enhancements

Shielded Carrier

Low Inductance

Elastomeric Cable

26 patents: Sort by Forward Citations

1. 6846184 - Low inductance electrical contacts and LGA connector system (2005-01-25),

2. 6742426 - Precision cutter for elastomeric cable (2004-06-01),

3. 6723927 - High-reliability interposer for low cost and high reliability applications (2004-04-20),

4. 6722893 - Test and burn-in connector (2004-04-20),

5. 6712621 - Thermally enhanced interposer and method (2004-03-30),

6. 6712620 - Coaxial elastomeric connector system (2004-03-30),

7. 6705877 - Stackable memory module with variable bandwidth (2004-03-16),

8. 6663399 - Surface mount attachable land grid array connector and method of forming same (2003-12-16),

9. 6661690 - High capacity memory module with built-in performance enhancing features (2003-12-09),

10. 6659778 - Contact assembly for land grid array interposer or electrical connector (2003-12-09),

11. 6638077 - Shielded carrier with components for land grid array connectors (2003-10-28),

12. 6597062 - Short channel, memory module with stacked printed circuit boards (2003-07-22),

13. 6590159 - Compact stacked electronic package (2003-07-08),

14. 6551112 - Test and burn-in connector (2003-04-22),

15. 6546625 - Method of forming a contact member cable (2003-04-15),

Company Overview

High Connection Density Inc. is a technology company based in Sunnyvale, California, specializing in advanced connectivity solutions. The organization focuses on developing innovative products and systems that enhance communication and data transfer capabilities across various platforms. Their expertise spans multiple domains, including telecommunications and networking technologies, aiming to address the growing demands for high-performance connectivity in both consumer and industrial applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

26 Patents

#153 in Sunnyvale, CA

#3,043 in California

#12,865 in US

#24,826 in the World

Sunnyvale, CA, United States of America

High Connection Density Inc.

Forward Citations = 862

19 inventors:

Che-Yu Li (24 out of 43 patents)

Zhineng Fan (15 out of 15 patents)

Ai D Le (9 out of 9 patents)

4. Sharon Laura Moriarty (4 out of 4 patents)

5. Dirk Dewar Brown (3 out of 38 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: High Connection Density Inc.. Retrieved from https://idiyas.com/company/high-connection-density

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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