David A Lysack

Title: David A. Lysack: Innovator in High-Density Memory and Integrated Circuit Technologies

Introduction

David A. Lysack is a notable inventor based in Liverpool, NY (US), recognized for his contributions to the field of integrated circuits and memory modules. With a total of two patents to his name, Lysack has made significant advancements in high-performance electronic systems.

Latest Patents

Lysack's latest patents include "High I/O Stacked Modules for Integrated Circuits" and "High Capacity Memory Module with High Electrical Design Margins." The first patent presents a cost-effective module that ensures high performance, density, and reliability in interconnections among various circuit devices. This invention is particularly suitable for applications in mainframe computers, workstations, and telecommunications networks. It features high-speed, impedance-controlled transmission line signal paths and includes thermal control structures to maintain optimal operating temperatures.

The second patent focuses on a memory module designed for high-speed, impedance-controlled buses. This innovative memory module allows for the use of conventional printed circuit cards with memory chips directly attached. It also introduces a pin-in-hole contact system for connecting sub-modules, enhancing the module's capacity and reliability by preventing excess heat build-up.

Career Highlights

David A. Lysack is currently associated with High Connection Density Inc., where he continues to develop cutting-edge technologies in the electronics sector. His work has significantly impacted the design and functionality of high-density memory and integrated circuit systems.

Collaborations

Lysack has collaborated with notable colleagues, including Che-Yu Li and Brian David Harry, contributing to the advancement of innovative technologies in their field.

Conclusion

David A. Lysack's contributions to integrated circuits and memory technology exemplify his commitment to innovation and excellence in the electronics industry. His patents reflect a deep understanding of the complexities involved in high-performance electronic systems.