Linh Van

Title: Linh Van: Innovator in Electronic Interconnection Technology

Introduction

Linh Van is a notable inventor based in Fremont, California, recognized for his contributions to electronic interconnection technology. With two patents to his name, he has made significant strides in the field, particularly in the development of innovative devices that enhance connectivity between electronic systems.

Latest Patents

Linh Van's latest patent is for a Test and Burn-in Connector. This interconnection device is designed for the temporary connection of a first electronic system to a second electronic system. It features a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to these conductive solder pads. Each coil signal contact comprises a central longitudinal axis, a top turn, and a bottom turn that are arranged in spaced relation to one another. The bottom turn of each coil signal contact is fastened to the conductive pads, ensuring that the top turns are spaced away from the support substrate. This innovative design facilitates efficient testing and burn-in processes for electronic systems.

Career Highlights

Linh Van is currently employed at High Connection Density Inc., where he continues to develop cutting-edge technologies in electronic interconnections. His work has been instrumental in advancing the capabilities of electronic systems, making them more efficient and reliable.

Collaborations

Linh has collaborated with talented individuals such as Che-Yu Li and Zhineng Fan, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Linh Van's contributions to the field of electronic interconnection technology highlight his role as a significant inventor. His innovative designs and collaborative efforts continue to push the boundaries of what is possible in electronic systems.