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For the Inventor, By the Inventor

Nagano, Japan

Fict Limited


USPTO Granted Patents = 3

Trademarks = 2

Forward Citations = 0

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11 inventors (with patents filed for the assignee):

goldMedal Taiji Sakai (3 out of 21 patents)

silverMedal Kenji Iida (2 out of 3 patents)

bronzeMedal Norikazu Ozaki (2 out of 3 patents)

4.  Takashi Nakagawa (2 out of 2 patents)

5.  Kenji Takano (2 out of 2 patents)

6.  Toshiki Iwai (1 out of 1 patent)

7.  Takayuki Inaba (1 out of 1 patent)

8.  Akira Yajima (1 out of 1 patent)

9.  Shin Hirano (1 out of 1 patent)

10.  Kota Aoi (1 out of 1 patent)

11.  Tetsuro Miyagawa (1 out of 1 patent)


3 patents:

1. 12666546 - Circuit board with a plurality of laminated insulating layers having conductive paste filled vias and manufacturing method thereof (2026-06-23),
2. 12520423 - Method for manufacturing circuit board (2026-01-06),
3. 11852866 - Waveguide member and waveguide layered product (2023-12-26),
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USPTO Data Jan 1 1976 - Sep 15 2026

3 Patents

#122 in Nagano

#8,997 in Japan

Nagano, JP
Nagano, Japan

Fict Limited

Forward Citations = 0

11 inventors:

goldMedal Taiji Sakai (3 out of 21 patents)

silverMedal Kenji Iida (2 out of 3 patents)

bronzeMedal Norikazu Ozaki (2 out of 3 patents)

4.  Takashi Nakagawa (2 out of 2 patents)

5.  Kenji Takano (2 out of 2 patents)

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