The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Feb. 14, 2022
Fict Limited, Nagano, JP;
Kenji Iida, Nagano, JP;
Norikazu Ozaki, Nagano, JP;
Taiji Sakai, Nagano, JP;
Takashi Nakagawa, Nagano, JP;
Kenji Takano, Nagano, JP;
FICT LIMITED, Nagano, JP;
Abstract
The present invention addresses the problem of providing a circuit board for which the manufacturing process is short and which has a laminate surface having uniform flatness. As a solution to the problem, this method for manufacturing a circuit board includes: manufacturing a three-layer metal () having, on one surface thereof, a first metal layer () formed in a pattern shape; manufacturing unit structures () each having the first metal layer (), a cured first insulating base material () filled with a cured first conductive paste (), a second metal layer (), and a semi-cured second insulating base material () filled with a semi-cured second conductive paste (); joining together the first insulating base material () in one unit structure () among a plurality of the unit structures with the second insulating base material () in another unit structure (); and layering the plurality of unit structures ().