The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Mar. 01, 2021
Fict Limited, Nagano, JP;
Kenji Iida, Nagano, JP;
Norikazu Ozaki, Nagano, JP;
Taiji Sakai, Nagano, JP;
Takashi Nakagawa, Nagano, JP;
Kenji Takano, Nagano, JP;
Takayuki Inaba, Nagano, JP;
Akira Yajima, Nagano, JP;
Shin Hirano, Nagano, JP;
Kota Aoi, Nagano, JP;
Tetsuro Miyagawa, Nagano, JP;
FICT LIMITED, Nagano, JP;
Abstract
A circuit board includes a plurality of first insulating base materials and a plurality of second insulating base materials that are alternately laminated, a first metal layer being formed into a pattern shape on a first surface of the first insulating base material, and a second metal layer being formed into a pattern shape on a second surface of the first insulating base material. The first metal layer is formed into a trapezoidal shape that is large in diameter on a first surface side of the first insulating base material. The second metal layer is formed into a trapezoidal shape that is large in diameter on a second surface side of the first insulating base material. The first metal layers and the second metal layers are laminated in such a manner that the trapezoidal shapes are alternately oriented.