The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Feb. 22, 2022
Fict Limited, Nagano, JP;
Taiji Sakai, Nagano, JP;
Kenji Iida, Nagano, JP;
Norikazu Ozaki, Nagano, JP;
Kenji Takano, Nagano, JP;
Takashi Nakagawa, Nagano, JP;
Takayuki Inaba, Nagano, JP;
Tetsuro Miyagawa, Nagano, JP;
Akira Yajima, Nagano, JP;
Shin Hirano, Nagano, JP;
Kota Aoi, Nagano, JP;
Yoichi Abe, Nagano, JP;
Mio Emura, Nagano, JP;
FICT LIMITED, Nagano, JP;
Abstract
An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (A) has a configuration in which a first insulating substrate () is laminated on a second insulating substrate () while interposing a first adhesive layer (), and a semiconductor device () is embedded in an embedment portion () formed in the first insulating substrate ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile