Nagano, Japan

Yoichi Abe

This inventor holds 1 USPTO granted patent. Top assignee: Fict Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoichi Abe. Retrieved from https://idiyas.com/inventor/yoichi-abe-tc1ynzgq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yoichi Abe: Inventor in Nagano, Japan.

Introduction

Yoichi Abe is an inventor associated with Fict Limited in Nagano, Japan. His work includes a patented circuit-board design intended to improve reliability across a wide range of operating temperatures.

Latest Patents

Abe is credited with 1 patent: “Circuit board, method for manufacturing circuit board, and electronic device.” The invention addresses the challenge of embedding a semiconductor device in a circuit board while preventing cracking. Its proposed structure laminates a first insulating substrate onto a second insulating substrate with a first adhesive layer between them, and embeds the semiconductor device in a portion formed in the first substrate. The design aims to support reliable operation over a wide temperature range.

Career Highlights

Abe’s listed patent reflects work on circuit-board construction, manufacturing methods, and electronic devices. The invention focuses on structural reliability when a semiconductor device is built into an insulating substrate.

Collaborations

Abe is associated with Fict Limited. His listed coworker is Kenji Iida.

Conclusion

Yoichi Abe’s patent centers on an embedded-semiconductor circuit board designed to resist cracking and maintain reliable operation across varying temperatures.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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