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For the Inventor, By the Inventor

Seoul, South Korea

Doosan Corporation


USPTO Granted Patents = 83

% Expired Patents = 21.7


Trademarks = 13

Forward Citations = 230

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165 inventors (with patents filed for the assignee):

goldMedal Chang Jun Lee (9 out of 13 patents)

silverMedal Kyoung-Soo Kim (9 out of 10 patents)

bronzeMedal Tae Hyung Kim (7 out of 18 patents)

4.  Tae-hyung Kim (6 out of 32 patents)

5.  Ho Cheol Park (6 out of 7 patents)

6.  Sung Kyu Kang (6 out of 6 patents)

7.  Byung-Sun Hong (5 out of 9 patents)

8.  Mee-Nam Shinn (5 out of 9 patents)

9.  Young Mi Beak (5 out of 6 patents)

10.  Chang Seo Park (5 out of 5 patents)

11.  Jin Yong Shin (5 out of 6 patents)

12.  Jeong Don Kwon (4 out of 4 patents)

13.  Jin-Seok Hong (4 out of 25 patents)

14.  Guk Hoon Chung (4 out of 4 patents)

15.  Hoe Moon Kim (4 out of 6 patents)


Core Competencies:
Semiconductor Packaging
Adhesive Composition
Underfill Film
Resin Composition
Composite Substrate
Fuel Cell Separator
Organic Electroluminescent Device
Forklift Technology
Thermosetting Resin
Energy Reclaiming System
Motor Control Method
Optical Interconnection Module

83 patents:

1. 12680002 - Underfill film for semiconductor package and method for manufacturing semiconductor package using same (2026-07-14),
2. 12410347 - Adhesive composition, and coverlay film and printed circuit board that include the same (2025-09-09),
3. 12378448 - Non-conductive adhesive film for semiconductor package and semiconductor package manufacturing method using same (2025-08-05),
4. 12278117 - Underfill film for semiconductor package and method for manufacturing semiconductor package using the same (2025-04-14),
5. 12274009 - Laminator (2025-04-08),
6. 12219715 - System and method for manufacturing composite board (2025-02-04),
7. 12082348 - System and method for manufacturing composite substrate (2024-09-03),
8. 11942336 - Underfill film for semiconductor package and method for manufacturing semiconductor package using the same (2024-03-26),
9. 11820885 - Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate (2023-11-21),
10. 11814275 - Forklift truck (2023-11-14),
11. 11407329 - Apparatus and method for controlling vehicles motor based on temperature of battery (2022-08-09),
12. 11401144 - Fork movement control device (2022-08-02),
13. 11293319 - System for regenerating DPF during operation of engine-powered forklift and method therefor (2022-04-05),
14. 10998557 - Separator for fuel cell, manufacturing method thereof, and fuel cell having such a separator (2021-05-04),
15. D908305 - Forklift (2021-01-19),
Doosan Corporation, headquartered in Seoul, South Korea, is a prominent player in the semiconductor packaging sector. The company specializes in advanced technologies such as adhesive compositions, underfill films, and resin compositions, which are critical for enhancing the performance and reliability of semiconductor devices. Additionally, Doosan is involved in the development of composite substrates and fuel cell separators, contributing to innovations in energy solutions. Their expertise also extends to organic electroluminescent devices and forklift technology, showcasing a diverse technological portfolio.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

Doosan Corporation
83 Patents

#88 in Seoul

#218 in South Korea

#9,133 in the World

Seoul, KR
Seoul, South Korea

Doosan Corporation

Forward Citations = 230

165 inventors:

goldMedal Chang Jun Lee (9 out of 13 patents)

silverMedal Kyoung-Soo Kim (9 out of 10 patents)

bronzeMedal Tae Hyung Kim (7 out of 18 patents)

4.  Tae-hyung Kim (6 out of 32 patents)

5.  Ho Cheol Park (6 out of 7 patents)

Please report any incorrect information to [email protected]
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