The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Sep. 02, 2019
Applicant:

Doosan Corporation, Seoul, KR;

Inventors:

Jinsoo Lee, Yongin-si, KR;

Hyungkyu Kim, Yongin-si, KR;

Kyeongwoon Cho, Yongin-si, KR;

Assignee:

DOOSAN CORPORATION, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); C08L 27/18 (2006.01); C09J 7/28 (2018.01); B32B 15/04 (2006.01); B32B 37/10 (2006.01); C09J 127/18 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 27/18 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); B32B 37/10 (2013.01); C09J 7/28 (2018.01); C09J 127/18 (2013.01); H05K 1/0373 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2307/204 (2013.01); B32B 2307/30 (2013.01); B32B 2307/54 (2013.01); B32B 2311/12 (2013.01); B32B 2457/08 (2013.01); C08L 2203/20 (2013.01); C09J 2400/163 (2013.01); C09J 2427/00 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/0338 (2013.01);
Abstract

A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.


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