The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Dec. 14, 2020
Applicant:

Doosan Corporation, Seoul, KR;

Inventors:

Sungmoon Kim, Yongin-si, KR;

Hyungrae Roh, Yongin-si, KR;

Kwangseok Park, Yongin-si, KR;

Sanghwa Kim, Yongin-si, KR;

Assignee:

DOOSAN CORPORATION, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/06 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); B32B 37/00 (2006.01); B32B 37/20 (2006.01); B32B 38/18 (2006.01); B32B 41/00 (2006.01); B65H 23/188 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/285 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); B32B 37/0053 (2013.01); B32B 37/025 (2013.01); B32B 37/06 (2013.01); B32B 37/206 (2013.01); B32B 38/1841 (2013.01); B32B 41/00 (2013.01); B65H 23/1888 (2013.01); B32B 2311/12 (2013.01); B32B 2379/08 (2013.01); B32B 2457/08 (2013.01); B65H 2555/40 (2013.01); H05K 2203/068 (2013.01);
Abstract

A laminator is disclosed. The laminator includes a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the substrate and the film are bonded; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.


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