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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11942336 B1

PDFFull Text
Date of Patent:
Mar. 26, 2024

Filed:

Aug. 17, 2021

Underfill film for semiconductor package and method for manufacturing semiconductor package using the same

Applicant:

Doosan Corporation, Seoul, KR;

Inventors:

Taejin Choi, Yongin-si, KR;

Chunggu Lee, Yongin-si, KR;

Sooin Park, Yongin-si, KR;

Jungjin Lee, Yongin-si, KR;

Assignee:

DOOSAN CORPORATION, Seoul, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Dale E Page

Assistant Examiner:

Wilner Jean Baptiste

Int. Cl.
CPC ...
H01L 21/56 (2006.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); C09J 163/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); C09J 7/38 (2018.01); C09J 7/405 (2018.01); C09J 163/00 (2013.01); H01L 24/92 (2013.01); C09J 2203/326 (2013.01); C09J 2463/00 (2013.01); C09J 2467/005 (2013.01); H01L 2224/92125 (2013.01);
Abstract

An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.

Find Patent Forward Citations

Choi, Taejin. (2024). Underfill film for semiconductor package and method for manufacturing semiconductor package using the same (U.S. Patent No. 11942336). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11942336

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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