The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Aug. 17, 2021
Applicant:
Doosan Corporation, Seoul, KR;
Inventors:
Taejin Choi, Yongin-si, KR;
Chunggu Lee, Yongin-si, KR;
Sooin Park, Yongin-si, KR;
Jungjin Lee, Yongin-si, KR;
Assignee:
DOOSAN CORPORATION, Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); C09J 163/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); C09J 7/38 (2018.01); C09J 7/405 (2018.01); C09J 163/00 (2013.01); H01L 24/92 (2013.01); C09J 2203/326 (2013.01); C09J 2463/00 (2013.01); C09J 2467/005 (2013.01); H01L 2224/92125 (2013.01);
Abstract
An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.