The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Aug. 23, 2019
Applicant:
Doosan Corporation, Seoul, KR;
Inventors:
Taejin Choi, Yongin-si, KR;
Woojeong Kim, Yongin-si, KR;
Assignee:
DOOSAN CORPORATION, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); H01L 23/00 (2006.01); C08K 3/36 (2006.01); C08K 5/3412 (2006.01); C08K 5/3432 (2006.01); C08K 5/3462 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); H01L 24/83 (2013.01); C08K 3/36 (2013.01); C08K 5/3412 (2013.01); C08K 5/3432 (2013.01); C08K 5/3462 (2013.01); C08K 2201/003 (2013.01); C08K 2201/011 (2013.01); C09J 2203/326 (2013.01); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); H01L 2224/83203 (2013.01);
Abstract
A non-conductive adhesive film for semiconductor packages and a method of manufacturing a semiconductor package using the non-conductive adhesive film are disclosed. The non-conductive adhesive film for semiconductor packages includes a base; and an adhesive layer disposed on one surface of the base and having a storage modulus in a range of 2 to 4 GPa at 25° C.