The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Jun. 25, 2020
Applicant:
Doosan Corporation, Seoul, KR;
Inventors:
Sungmoon Kim, Yongin-si, KR;
Jinwoo Kim, Yongin-si, KR;
Sanghwa Kim, Yongin-si, KR;
Euidock Ryu, Yongin-si, KR;
Hyungrae Roh, Yongin-si, KR;
Assignee:
DOOSAN CORPORATION, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/28 (2013.01); H05K 2203/166 (2013.01);
Abstract
A system for manufacturing a printed circuit board includes a coverlay supply apparatus configured to supply a coverlay; a printed circuit board supply apparatus configured to supply a printed circuit board; and a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board.