Euidock Ryu

Title: Innovations of Euidock Ryu

Introduction

Euidock Ryu is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of adhesive compositions and printed circuit boards. With a total of three patents to his name, Ryu's work showcases his expertise and innovative spirit.

Latest Patents

Ryu's latest patents include an adhesive composition and a coverlay film and printed circuit board that incorporate this composition. The adhesive composition consists of an epoxy resin and a binder resin that includes epoxidized polybutadiene rubber along with at least two types of rubber. This innovative adhesive composition is designed to form a layer that excels in adhesiveness, fluidity, filling properties, migration resistance, heat resistance, flame retardancy, low elongation, and flexibility. Additionally, he has developed a system and method for manufacturing composite boards, which includes a coverlay supply apparatus and a printed circuit board supply apparatus that work together to create a first composite board.

Career Highlights

Euidock Ryu is currently employed at Doosan Corporation, where he continues to push the boundaries of technology and innovation. His work has been instrumental in advancing the capabilities of printed circuit boards and adhesive materials.

Collaborations

Ryu collaborates with talented individuals such as Sungmoon Kim and Jinwoo Kim, contributing to a dynamic and innovative work environment.

Conclusion

Euidock Ryu's contributions to adhesive compositions and printed circuit boards highlight his role as a leading inventor in his field. His innovative patents and collaborative efforts at Doosan Corporation reflect his commitment to advancing technology.