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For the Inventor, By the Inventor

Waterloo, Canada

Dalsa Semiconductor Inc.

Calculating rank
USPTO Granted Patents = 35

% Expired Patents = 22.9



Forward Citations = 690

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35 inventors (with patents filed for the assignee):

goldMedal Luc M Ouellet (28 out of 43 patents)

silverMedal Robert Antaki (6 out of 6 patents)

bronzeMedal Jonathan Lachance (4 out of 4 patents)

4.  Stephane Martel (3 out of 4 patents)

5.  Yves Tremblay (3 out of 6 patents)

6.  Sylvie Archambault (2 out of 2 patents)

7.  Yan Riopel (2 out of 2 patents)

8.  Sebastien Michel (2 out of 2 patents)

9.  Manuel Grondin (2 out of 2 patents)

10.  Stephane Blain (2 out of 3 patents)

11.  Riopel Yan (2 out of 2 patents)

12.  Vincent Fortin (1 out of 2 patents)

13.  Mamur Chowdhury (1 out of 1 patent)

14.  Patrick Wright (1 out of 1 patent)

15.  Veronique Giard (1 out of 1 patent)


Core Competencies:
BIOMEMS Devices
MEMS Wafers
Film Stress Control
Microchannels
Wafer-Level Packaging
Silicon-Based MEMS
Optical Sensors
High-Voltage Devices
Dielectric Films
Fluidic Devices
Photonic Devices
Silica Waveguides

35 patents:

1. 7927904 - Method of making BIOMEMS devices (2011-04-19),
2. 7807550 - Method of making MEMS wafers (2010-10-05),
3. 7799656 - Microchannels for BioMEMS devices (2010-09-21),
4. 7799376 - Method of controlling film stress in MEMS devices (2010-09-21),
5. 7682860 - Protection capsule for MEMS devices (2010-03-23),
6. 7614253 - Method of reducing stress-induced mechanical problems in optical components (2009-11-10),
7. 7579622 - Fabrication of MEMS devices with spin-on glass (2009-08-25),
8. 7459329 - Method of fabricating silicon-based MEMS devices (2008-12-02),
9. 7439093 - Method of making a MEMS device containing a cavity with isotropic etch followed by anisotropic etch (2008-10-21),
10. 7365016 - Anhydrous HF release of process for MEMS devices (2008-04-29),
11. 7341905 - Method of making high-voltage bipolar/CMOS/DMOS (BCD) devices (2008-03-11),
12. 7291513 - Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy (2007-11-06),
13. 7160752 - Fabrication of advanced silicon-based MEMS devices (2007-01-09),
14. 7144750 - Method of fabricating silicon-based MEMS devices (2006-12-05),
15. 7138293 - Wafer level packaging technique for microdevices (2006-11-21),
Company Overview
Dalsa Semiconductor Inc., based in Waterloo, Canada, specializes in the design and manufacture of advanced imaging and semiconductor technologies. The company focuses on high-performance image sensors and cameras, catering to various industries including industrial automation, medical imaging, and scientific research. Dalsa is recognized for its innovative contributions to the field of digital imaging, leveraging cutting-edge research to enhance imaging solutions and meet the evolving demands of its global clientele.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 27 2026

Dalsa Semiconductor Inc. USPTO Patent Assignee Logo
35 Patents

#15 in Waterloo

#384 in Canada

#19,187 in the World

Waterloo, CA
Waterloo, Canada

Dalsa Semiconductor Inc.

Forward Citations = 690

35 inventors:

goldMedal Luc M Ouellet (28 out of 43 patents)

silverMedal Robert Antaki (6 out of 6 patents)

bronzeMedal Jonathan Lachance (4 out of 4 patents)

4.  Stephane Martel (3 out of 4 patents)

5.  Yves Tremblay (3 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Dalsa Semiconductor Inc.. Retrieved from https://idiyas.com/company/dalsa-semiconductor

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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