For the Inventor, By the Inventor

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Waterloo, Canada

Dalsa Semiconductor Inc.

USPTO Granted Patents = 35

% Expired Patents = 22.9

CIPO Patents = 1

EPO Patents = 3

Forward Citations = 690

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35 inventors (with patents filed for the assignee):

Luc M Ouellet (28 out of 43 patents)

Robert Antaki (6 out of 6 patents)

Jonathan Lachance (4 out of 4 patents)

4. Stephane Martel (3 out of 4 patents)

5. Yves Tremblay (3 out of 6 patents)

6. Sylvie Archambault (2 out of 2 patents)

7. Yan Riopel (2 out of 2 patents)

8. Sebastien Michel (2 out of 2 patents)

9. Manuel Grondin (2 out of 2 patents)

10. Stephane Blain (2 out of 3 patents)

11. Riopel Yan (2 out of 2 patents)

12. Vincent Fortin (1 out of 2 patents)

13. Mamur Chowdhury (1 out of 1 patent)

14. Patrick Wright (1 out of 1 patent)

15. Veronique Giard (1 out of 1 patent)

Core Competencies:

BIOMEMS Devices

MEMS Wafers

Film Stress Control

Microchannels

Wafer-Level Packaging

Silicon-Based MEMS

Optical Sensors

High-Voltage Devices

Dielectric Films

Fluidic Devices

Photonic Devices

Silica Waveguides

35 patents: Sort by Forward Citations

1. 7927904 - Method of making BIOMEMS devices (2011-04-19),

2. 7807550 - Method of making MEMS wafers (2010-10-05),

3. 7799656 - Microchannels for BioMEMS devices (2010-09-21),

4. 7799376 - Method of controlling film stress in MEMS devices (2010-09-21),

5. 7682860 - Protection capsule for MEMS devices (2010-03-23),

6. 7614253 - Method of reducing stress-induced mechanical problems in optical components (2009-11-10),

7. 7579622 - Fabrication of MEMS devices with spin-on glass (2009-08-25),

8. 7459329 - Method of fabricating silicon-based MEMS devices (2008-12-02),

9. 7439093 - Method of making a MEMS device containing a cavity with isotropic etch followed by anisotropic etch (2008-10-21),

10. 7365016 - Anhydrous HF release of process for MEMS devices (2008-04-29),

11. 7341905 - Method of making high-voltage bipolar/CMOS/DMOS (BCD) devices (2008-03-11),

12. 7291513 - Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy (2007-11-06),

13. 7160752 - Fabrication of advanced silicon-based MEMS devices (2007-01-09),

14. 7144750 - Method of fabricating silicon-based MEMS devices (2006-12-05),

15. 7138293 - Wafer level packaging technique for microdevices (2006-11-21),

Dalsa Semiconductor Inc., based in Waterloo, Canada, specializes in the design and manufacture of advanced imaging and semiconductor technologies. The company focuses on high-performance image sensors and cameras, catering to various industries including industrial automation, medical imaging, and scientific research. Dalsa is recognized for its innovative contributions to the field of digital imaging, leveraging cutting-edge research to enhance imaging solutions and meet the evolving demands of its global clientele.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

Dalsa Semiconductor Inc.

35 Patents

#15 in Waterloo

#382 in Canada

#19,148 in the World

Waterloo, Canada

Dalsa Semiconductor Inc.

Forward Citations = 690

35 inventors:

Luc M Ouellet (28 out of 43 patents)

Robert Antaki (6 out of 6 patents)

Jonathan Lachance (4 out of 4 patents)

4. Stephane Martel (3 out of 4 patents)

5. Yves Tremblay (3 out of 6 patents)

Please report any incorrect information to [email protected]

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