The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2007
Filed:
Dec. 07, 2004
Luc Ouellet, Granby, CA;
Karine Turcotte, Montreal, CA;
Luc Ouellet, Granby, CA;
Karine Turcotte, Montreal, CA;
DALSA Semiconductor Inc., Waterloo, ON, CA;
Abstract
A method is disclosed for making a wafer-level package for a plurality of MEMS devices. The method involves preparing a MEMS wafer and a lid wafer, each having respective bonding structures. The lid and MEMS wafers are then bonded together through the bonding structures. The wafers are substantially free of alkali metals and/or chlorine. IN a preferred embodiment, each wafer has a seed layer, a structural underlayer and an anti-oxidation layer. A solder layer, normally formed on the lid wafer, bonds the two wafers together.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile