The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2008

Filed:

Dec. 27, 2004
Applicants:

Stephane Martel, Granby, CA;

Yan Riopel, Bromont, CA;

Sebastien Michel, Bromont, CA;

Luc Ouellet, Granby, CA;

Inventors:

Stephane Martel, Granby, CA;

Yan Riopel, Bromont, CA;

Sebastien Michel, Bromont, CA;

Luc Ouellet, Granby, CA;

Assignee:

DALSA Semiconductor Inc., Waterloo, CA;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/84 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for making an integrated circuit is described wherein sequence of mask steps is applied to a substrate or epitaxial layer of p-type material. The sequence consists of sixteen specific mask steps that permit a variety of bipolar/CMOS/DMOS devices to be fabricated. The mask steps include (1) forming at least one N-well in the p-type material, (2) forming an active region, forming a p-type field region, (4) forming a gate oxide, (5) carrying out a p-type implantation, (6) forming polysilicon gate regions, (7) forming a p-base region, (8) forming a N-extended region, (9) forming a p-top region, 10) carrying out an N+ implant, (11) carrying out a P+ implant, (12) forming contacts, (13) depositing a metal layer, (14) forming vias, (15) depositing a metal layer therethrough, and (16) forming a passivation layer. Up to any three of mask steps (4), (7), (8), and (9) may be omitted depending on the type of integrated circuit.


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