Columbus, OH, United States of America

Bread Financial Payments, Inc.

USPTO Granted Patents = 18

Trademarks = 62

Forward Citations = 31

Loading Chart...
Loading Chart...

29 inventors (with patents filed for the assignee):

goldMedal Christian Billman (6 out of 16 patents)

silverMedal Uchenna Chilaka (5 out of 13 patents)

bronzeMedal Jess Lawrence (5 out of 9 patents)

4.  Timothy D Pontious (4 out of 6 patents)

5.  Celeste Rechner (3 out of 4 patents)

6.  Manoj Ram Tammina (3 out of 6 patents)

7.  James Walz (2 out of 18 patents)

8.  Timothy Jones (2 out of 2 patents)

9.  Gabriel Rostorfer (2 out of 2 patents)

10.  Joseph Butvin (1 out of 2 patents)

11.  Kurt Brown (1 out of 2 patents)

12.  Christina Mosholder (1 out of 3 patents)

13.  Randall Piatt (1 out of 6 patents)

14.  Tom Pugh (1 out of 3 patents)

15.  Chris Anderson (1 out of 4 patents)


18 patents:

Company Overview
Bread Financial Payments, Inc. is a financial technology company based in Columbus, Ohio, specializing in providing innovative payment solutions. The organization focuses on enhancing consumer experiences through flexible financing options and seamless digital payment systems. With a commitment to leveraging technology, Bread Financial aims to simplify transactions and improve accessibility for both consumers and merchants. Its expertise spans various sectors, including retail and e-commerce, positioning it as a key player in the evolving landscape of financial services.
Profile summary synthesized from public USPTO records and patent filings.

logo

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

18 Patents

#44 in Columbus, OH

#769 in Ohio

#17,974 in US

#34,244 in the World

Columbus, OH (US)
Columbus, OH, United States of America
Forward Citations = 31

29 inventors:

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Bread Financial Payments, Inc.. Retrieved from https://idiyas.com/company/bread-financial-payments

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…