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Berlin, Germany

Atotech Deutschland Gmbh & Co. Kg

USPTO Granted Patents = 13

CIPO Patents = 4

EPO Patents = 19

Trademarks = 36

Forward Citations = 0

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103 inventors (with patents filed for the assignee):

Horst Brüggmann (3 out of 5 patents)

Bert Reents (3 out of 7 patents)

Akif Özkök (3 out of 4 patents)

4. Marko Mirkovic (3 out of 3 patents)

5. Thomas Schiwon (2 out of 4 patents)

6. Soungsoo Kim (2 out of 5 patents)

7. Robert Rüther (2 out of 4 patents)

8. Olaf Kurtz (2 out of 10 patents)

9. Tse-Cheen Foong (2 out of 2 patents)

10. Joko Setyadi-Lie (2 out of 2 patents)

11. Herwig Josef Berthold (2 out of 2 patents)

12. Marcin Klobus (2 out of 2 patents)

13. Sebastian Zarwell (1 out of 2 patents)

14. Philip Hartmann (1 out of 14 patents)

15. Josef Gaida (1 out of 11 patents)

13 patents: Sort by Forward Citations

1. 12439528 - Method of preparing a high density interconnect printed circuit board including microvias filled with copper (2025-10-07),

2. 12435273 - Method for etching at least one surface of a plastic substrate (2025-10-07),

3. 12371811 - Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus (2025-07-29),

4. 12359332 - Copper electroplating bath (2025-07-15),

5. 12245383 - Method of preparing a high density interconnect printed circuit board including microvias filled with copper (2025-03-04),

6. 12173422 - Electroplating composition and method for electroplating a chromium coating on a substrate (2024-12-24),

7. 12063751 - Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board (2024-08-13),

8. 12054843 - Acidic aqueous composition for electrolytically depositing a copper deposit (2024-08-06),

9. 11963308 - Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer (2024-04-16),

10. 11946152 - Method and system for depositing a zinc-nickel alloy on a substrate (2024-04-02),

11. 11851780 - Method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy (2023-12-26),

12. 11761090 - Method for monitoring the total amount of sulphur containing compounds in a metal plating bath (2023-09-19),

13. 11447884 - Method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy (2022-09-20),

Atotech is a global leader in surface-finishing solutions. The company provides innovative chemical processes and equipment for the advanced technology industry. With a focus on sustainability and efficiency, Atotech offers a wide range of products and services for electronics, automotive, and industrial applications. With a strong commitment to research and development, Atotech continues to drive innovation and excellence in surface finishing.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

13 Patents

#70 in D-1000 Berlin

#3,063 in Germany

#43,615 in the World

Berlin, Germany

Atotech Deutschland Gmbh & Co. Kg

Forward Citations = 0

103 inventors:

Horst Brüggmann (3 out of 5 patents)

Bert Reents (3 out of 7 patents)

Akif Özkök (3 out of 4 patents)

4. Marko Mirkovic (3 out of 3 patents)

5. Thomas Schiwon (2 out of 4 patents)

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