Thomas Schiwon

Title: Thomas Schiwon: Innovator in High Density Interconnect Technology

Introduction

Thomas Schiwon is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of printed circuit board technology, particularly in high density interconnect (HDI) systems. With a total of 4 patents to his name, Schiwon has established himself as a key figure in the advancement of electronic manufacturing processes.

Latest Patents

One of Schiwon's latest patents is a method of preparing a high density interconnect printed circuit board that includes microvias filled with copper. This innovative method addresses the challenges associated with creating HDI PCBs or integrated circuit substrates that feature through-holes and grate structures filled with copper. The process involves several steps that enhance the efficiency and effectiveness of PCB manufacturing.

Career Highlights

Throughout his career, Thomas Schiwon has worked with prominent companies in the electronics industry. Notably, he has been associated with Atotech Deutschland GmbH and Atotech Deutschland GmbH & Co. KG. His work in these organizations has allowed him to develop and refine his expertise in PCB technology.

Collaborations

Schiwon has collaborated with several professionals in his field, including Horst Brüggmann and Toshia Fujiwara. These partnerships have contributed to the development of innovative solutions in the realm of printed circuit boards.

Conclusion

In summary, Thomas Schiwon is a distinguished inventor whose work in high density interconnect technology has made a lasting impact on the electronics industry. His patents and collaborations reflect his commitment to advancing PCB manufacturing processes.