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Berlin, Germany

Atotech Deutschland Gmbh

USPTO Granted Patents = 288

% Expired Patents = 26.7

CIPO Patents = 9

EPO Patents = 208

Trademarks = 106

Forward Citations = 1,379

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443 inventors (with patents filed for the assignee):

Heinrich Meyer (23 out of 27 patents)

Heiko Brunner (22 out of 23 patents)

Philipp Wachter (14 out of 14 patents)

4. Philip Hartmann (13 out of 14 patents)

5. Reinhard Schneider (12 out of 14 patents)

6. Wolfgang Dahms (11 out of 17 patents)

7. Dirk Rohde (10 out of 10 patents)

8. Lars Kohlmann (10 out of 10 patents)

9. Craig V Bishop (10 out of 20 patents)

10. Klaus-Dieter Schulz (9 out of 10 patents)

11. Arnd Kilian (8 out of 16 patents)

12. Sven Lamprecht (8 out of 9 patents)

13. Ferdinand Wiener (8 out of 10 patents)

14. Nayan H Joshi (8 out of 8 patents)

15. Olaf Kurtz (8 out of 10 patents)

Core Competencies:

Copper Plating

Corrosion Protection

Electrolytic Deposition

Metal Alloy

Plating Bath

Surface Treatment

Adhesion Strength

Electroless Plating

Zinc-Nickel Alloy

Chromium Coating

288 patents: Sort by Forward Citations

1. 12448689 - Aqueous post treatment composition and method for corrosion protection (2025-10-21),

2. 12320027 - Membrane anode system for electrolytic zinc-nickel alloy deposition (2025-06-03),

3. 12205838 - Device and method for moving an object into a processing station, conveying system and processing apparatus (2025-01-21),

4. 12115654 - End effector for slab formed substrates (2024-10-15),

5. 12071702 - Acidic aqueous composition for electrolytic copper plating (2024-08-27),

6. 12006585 - Method for depositing a chromium or chromium alloy layer and plating apparatus (2024-06-11),

7. 11991835 - Method for increasing adhesion strength between a metal and an organic material (2024-05-21),

8. 11603378 - Azole silane compound (2023-03-14),

9. 11512405 - Metal or metal alloy deposition composition and plating compound (2022-11-29),

10. 11512394 - Electroless gold plating bath (2022-11-29),

11. 11473036 - Cleaning solution for cleaning metal surfaces (2022-10-18),

12. 11443969 - Automated substrate holder loading device (2022-09-13),

13. 11408085 - Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating (2022-08-09),

14. 11396706 - Electroless copper or copper alloy plating bath and method for plating (2022-07-26),

15. 11274375 - Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate (2022-03-15),

Company Overview

Atotech Deutschland GmbH, headquartered in Berlin, specializes in advanced metal plating technology, focusing on innovative solutions for various industries. The company develops and manufactures products related to copper plating, corrosion protection, and electrolytic deposition, catering to the needs of electronics, automotive, and other sectors. With expertise in surface treatment and adhesion strength, Atotech is committed to enhancing the performance and reliability of metal components through its cutting-edge plating baths and electroless plating processes.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

288 Patents

#5 in D-1000 Berlin

#204 in Germany

#3,083 in the World

Berlin, Germany

Atotech Deutschland Gmbh

Forward Citations = 1,379

443 inventors:

Heinrich Meyer (23 out of 27 patents)

Heiko Brunner (22 out of 23 patents)

Philipp Wachter (14 out of 14 patents)

4. Philip Hartmann (13 out of 14 patents)

5. Reinhard Schneider (12 out of 14 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Atotech Deutschland Gmbh. Retrieved from https://idiyas.com/company/atotech-deutschland

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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