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Berlin, Germany

Atotech Deutschland Gmbh

USPTO Granted Patents = 288

CIPO Patents = 11

EPO Patents = 208

Trademarks = 116

Forward Citations = 1,367

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443 inventors (with patents filed for the assignee):

Heiko Brunner (22 out of 23 patents)

Heinrich Meyer (21 out of 27 patents)

Philipp Wachter (14 out of 14 patents)

4. Philip Hartmann (13 out of 14 patents)

5. Reinhard Schneider (12 out of 14 patents)

6. Wolfgang Dahms (11 out of 17 patents)

7. Dirk Rohde (10 out of 10 patents)

8. Lars Kohlmann (10 out of 10 patents)

9. Craig V Bishop (10 out of 20 patents)

10. Klaus-Dieter Schulz (9 out of 10 patents)

11. Arnd Kilian (8 out of 16 patents)

12. Sven Lamprecht (8 out of 9 patents)

13. Ferdinand Wiener (8 out of 9 patents)

14. Nayan H Joshi (8 out of 8 patents)

15. Olaf Kurtz (8 out of 10 patents)

Core Competencies:

Electrolytic Copper Plating

Metal Alloy Deposition

Corrosion Protection

Galvanic Nickel Plating

Aqueous Plating Compositions

Surface Treatment Solutions

Automated Substrate Handling

Indium Alloy Deposition

Palladium Plating Baths

Solderable Deposit Formation

Chromium Alloy Treatments

Electroless Gold Plating

288 patents: Sort by Forward Citations

1. 12448689 - Aqueous post treatment composition and method for corrosion protection (2025-10-21),

2. 12320027 - Membrane anode system for electrolytic zinc-nickel alloy deposition (2025-06-03),

3. 12205838 - Device and method for moving an object into a processing station, conveying system and processing apparatus (2025-01-21),

4. 12115654 - End effector for slab formed substrates (2024-10-15),

5. 12071702 - Acidic aqueous composition for electrolytic copper plating (2024-08-27),

6. 12006585 - Method for depositing a chromium or chromium alloy layer and plating apparatus (2024-06-11),

7. 11991835 - Method for increasing adhesion strength between a metal and an organic material (2024-05-21),

8. 11603378 - Azole silane compound (2023-03-14),

9. 11512405 - Metal or metal alloy deposition composition and plating compound (2022-11-29),

10. 11512394 - Electroless gold plating bath (2022-11-29),

11. 11473036 - Cleaning solution for cleaning metal surfaces (2022-10-18),

12. 11443969 - Automated substrate holder loading device (2022-09-13),

13. 11408085 - Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating (2022-08-09),

14. 11396706 - Electroless copper or copper alloy plating bath and method for plating (2022-07-26),

15. 11274375 - Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate (2022-03-15),

Atotech Deutschland GmbH is a leading global supplier of specialty chemicals, equipment, and services for the printed circuit board, semiconductor, and other industries. With a commitment to innovation and sustainability, Atotech delivers innovative solutions that enable its customers to meet the fast-changing demands of the modern world. Their comprehensive product portfolio includes advanced electroplating solutions, organic coatings, equipment, and analytical tools. Atotech serves customers in over 40 countries and operates in close partnership with its global network of research, development, and application laboratories.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

288 Patents

#4 in D-1000 Berlin

#226 in Germany

#2,987 in the World

Berlin, Germany

Atotech Deutschland Gmbh

Forward Citations = 1,367

443 inventors:

Heiko Brunner (22 out of 23 patents)

Heinrich Meyer (21 out of 27 patents)

Philipp Wachter (14 out of 14 patents)

4. Philip Hartmann (13 out of 14 patents)

5. Reinhard Schneider (12 out of 14 patents)

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