The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Jun. 05, 2019
Applicant:
Atotech Deutschland Gmbh, Berlin, DE;
Inventors:
Roman-David Kulko, Berlin, DE;
Sebastian Zarwell, Berlin, DE;
Kilian Klaeden, Berlin, DE;
Anna Peter, Berlin, DE;
Birgit Beck, Berlin, DE;
Assignee:
Atotech Deutschland GmbH, Berlin, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/40 (2006.01); C23C 18/16 (2006.01); C23C 18/48 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
C23C 18/40 (2013.01); C23C 18/1653 (2013.01); C23C 18/48 (2013.01); C25D 3/38 (2013.01);
Abstract
An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1):