Company Filing History:
Years Active: 2022
Title: The Innovations of Roman-David Kulko
Introduction
Roman-David Kulko is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of electroless plating, particularly with his innovative patent that focuses on copper and copper alloy plating methods. His work is essential for various applications in electronics and manufacturing.
Latest Patents
Kulko holds a patent for an "Electroless copper or copper alloy plating bath and method for plating." This invention involves a plating bath designed to deposit a copper or copper alloy layer on a substrate's surface. The bath includes copper ions, a reducing agent, and a complexing agent for copper ions. Additionally, it features at least one compound according to a specific formula, enhancing the efficiency and effectiveness of the plating process. He has 1 patent to his name.
Career Highlights
Roman-David Kulko is currently employed at Atotech Deutschland GmbH, a company renowned for its advanced plating technologies. His role at Atotech allows him to apply his expertise in electroless plating, contributing to the development of innovative solutions in the industry.
Collaborations
Kulko has worked alongside talented colleagues such as Sebastian Zarwell and Kilian Klaeden. Their collaborative efforts have fostered a creative environment that encourages innovation and the advancement of plating technologies.
Conclusion
Roman-David Kulko's contributions to the field of electroless plating exemplify the importance of innovation in technology. His patent and work at Atotech Deutschland GmbH highlight his commitment to advancing the industry.