Company Filing History:
Years Active: 2017-2022
Title: Birgit Beck: Innovator in Electroless Plating Technologies
Introduction
Birgit Beck is a prominent inventor based in Berlin, Germany. She has made significant contributions to the field of electroless plating, holding three patents that showcase her innovative approach to metal deposition technologies. Her work is instrumental in advancing the capabilities of plating processes used in various industries.
Latest Patents
Birgit Beck's latest patents include an "Electroless Copper or Copper Alloy Plating Bath and Method for Plating." This invention describes a plating bath designed for depositing a copper or copper alloy layer on a substrate surface. The bath contains copper ions, a reducing agent, and a complexing agent for copper ions, along with additional compounds that enhance its effectiveness. Another notable patent is the "Method for Electroless Plating," which outlines a process for depositing a metal or metal alloy onto structures made of metals such as molybdenum or titanium. This method involves activation, treatment in an aqueous solution with nitrogen-containing compounds or hydroxy carboxylic acids, and the subsequent electroless plating of the desired metal.
Career Highlights
Birgit Beck is currently employed at Atotech Deutschland GmbH, a company known for its expertise in surface finishing and plating technologies. Her role at Atotech allows her to apply her innovative ideas and contribute to the development of advanced plating solutions.
Collaborations
Throughout her career, Birgit has collaborated with notable colleagues, including Frank Brüning and Johannes Etzkorn. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Birgit Beck is a trailblazer in the field of electroless plating, with a strong portfolio of patents that reflect her innovative spirit. Her contributions to Atotech Deutschland GmbH and the broader industry continue to shape the future of plating technologies.
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