The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Dec. 14, 2018
Atotech Deutschland Gmbh, Berlin, DE;
Angela Llavona-Serrano, Berlin, DE;
Timo Bangerter, Berlin, DE;
Olivier Mann, Berlin, DE;
Pamela Cebulla, Berlin, DE;
Stefanie Ackermann, Berlin, DE;
Heiko Brunner, Berlin, DE;
Kinga Haubner, Berlin, DE;
Bernd Froese, Berlin, DE;
Atotech Deutschland GmbH, Berlin, DE;
Abstract
The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.