Timo Bangerter

Title: Timo Bangerter - Innovator in Metal Deposition Technologies

Introduction

Timo Bangerter is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of metal deposition, particularly in the development of innovative plating compositions. With a total of 2 patents, Bangerter's work is instrumental in advancing technologies used in electronic applications.

Latest Patents

Bangerter's latest patents include a metal or metal alloy deposition composition and a copper plating bath composition. The first patent focuses on a deposition composition that facilitates the electrolytic deposition of metal layers, specifically copper or copper alloys. This invention includes a method for preparing the plating compound, which is particularly useful for filling recessed structures with high aspect ratios. The second patent pertains to aqueous acidic plating baths designed for copper and copper alloy deposition, which are essential in the manufacturing of printed circuit boards and other electronic devices. This plating bath comprises copper ions, an acid, and a ureylene polymer, making it effective for building pillar bump structures.

Career Highlights

Bangerter is currently employed at Atotech Deutschland GmbH, where he continues to innovate in the field of metal deposition technologies. His work has been pivotal in enhancing the efficiency and effectiveness of plating processes used in various electronic applications.

Collaborations

Throughout his career, Bangerter has collaborated with notable colleagues, including Heiko Brunner and Olivier Mann. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Timo Bangerter is a distinguished inventor whose work in metal deposition technologies has made a significant impact on the electronics industry. His innovative patents and contributions continue to shape the future of plating processes.