Atotech Deutschland Gmbh

Timo Bangerter

Heiko Brunner

Olivier Mann

Stefanie Ackermann

Lars Kohlmann

Dirk Rohde

Bernd Roelfs

Andreas Kirbs

Angela Llavona-Serrano

Agnieszka Witczak

Christian Ohde

Bernd Froese

Pamela Cebulla

Angelo Ferro

Andre Schmökel

Kinga Haubner

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

Metal or metal alloy deposition composition and plating compound

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper plating bath composition

Growing community of inventors

Berlin, Germany

Timo Bangerter