The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Nov. 12, 2013
Atotech Deutschland Gmbh, Berlin, DE;
Heiko Brunner, Berlin, DE;
Bernd Roelfs, Berlin, DE;
Agnieszka Witczak, Berlin, DE;
Lars Kohlmann, Berlin, DE;
Olivier Mann, Berlin, DE;
Christian Ohde, Berlin, DE;
Timo Bangerter, Berlin, DE;
Angelo Ferro, Berlin, DE;
Andreas Kirbs, Berlin, DE;
Andre Schmökel, Berlin, DE;
Dirk Rohde, Wethau, DE;
Stefanie Ackermann, Berlin, DE;
Atotech Deutschland GmbH, Berlin, DE;
Abstract
The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.