Company Filing History:
Years Active: 2017-2024
Title: Olivier Mann - Innovator in Electrolytic Copper Plating
Introduction
Olivier Mann is a prominent inventor based in Berlin, Germany. He has made significant contributions to the field of electrolytic copper plating, holding a total of 7 patents. His work focuses on developing advanced compositions and methods for metal deposition, particularly in the context of enhancing the efficiency and effectiveness of plating processes.
Latest Patents
Among his latest patents, one notable invention is an acidic aqueous composition for electrolytic copper plating. This invention relates to a composition that includes one or a mixture of two or more quinoline-polyethylene glycol containing compounds. Each of these compounds plays a crucial role in improving the plating process. Another significant patent involves a metal or metal alloy deposition composition, specifically designed for electrolytic deposition of copper or copper alloy layers. This invention includes at least one type of metal ion, preferably copper ions, and at least one imidazole-based plating compound. The method for preparing this plating compound and its applications in metal deposition compositions are also covered in this patent.
Career Highlights
Olivier Mann is currently employed at Atotech Deutschland GmbH, a company known for its innovative solutions in the field of surface finishing and electroplating. His work at Atotech has allowed him to further develop his expertise and contribute to cutting-edge technologies in metal deposition.
Collaborations
Olivier collaborates with talented professionals in his field, including Heiko Brunner and Agnieszka Witczak. Their combined efforts contribute to the advancement of technologies in electrolytic plating and metal deposition.
Conclusion
Olivier Mann's contributions to the field of electrolytic copper plating through his innovative patents and collaborative efforts highlight his role as a key inventor in this industry. His work continues to influence advancements in metal deposition technologies.