The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Aug. 19, 2016
Applicant:

Atotech Deutschland Gmbh, Berlin, DE;

Inventors:

Heiko Brunner, Berlin, DE;

Lars Kohlmann, Berlin, DE;

Agnieszka Witczak, Berlin, DE;

Olivier Mann, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 75/02 (2006.01); C08G 71/02 (2006.01); C25D 3/38 (2006.01); C07C 275/22 (2006.01); C07D 233/61 (2006.01);
U.S. Cl.
CPC ...
C08L 75/02 (2013.01); C07C 275/22 (2013.01); C07D 233/61 (2013.01); C08G 71/02 (2013.01); C25D 3/38 (2013.01);
Abstract

The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.


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