Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Thomas Schiwon

Horst Brüggmann

Bert Reents

Soungsoo Kim

Akif Özkök

Roland Herold

Marko Mirkovic

Toshia Fujiwara

Herwig Josef Berthold

Marcin Klobus

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper, which comprises the steps of:

Method of preparing a high density interconnect printed circuit board including microvias filled with copper

Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration tand having a first forward pulse peak current i, and a first reverse pulse generating a first anodic current during a first reverse pulse duration tand having a first reverse pulse peak current i, the second forward-reverse pulse current sequence including a second forward pulse generating a second cathodic current during a second forward pulse duration tand having a second forward pulse peak current i, and a second reverse pulse generating a second anodic current during a second reverse pulse duration t, the second reverse pulse having a second reverse pulse peak current i.

Method and apparatus for electroplating a metal onto a substrate

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Berlin, Germany

Thomas Schiwon