The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Aug. 19, 2020
Applicant:
Atotech Deutschland Gmbh & Co. KG, Berlin, DE;
Inventors:
Akif Özkök, Berlin, DE;
Bert Reents, Berlin, DE;
Mustafa Özkök, Berlin, DE;
Marko Mirkovic, Berlin, DE;
Markus Youkhanis, Berlin, DE;
Horst Brüggmann, Berlin, DE;
Sven Lamprecht, Berlin, DE;
Kai-Jens Matejat, Berlin, DE;
Assignee:
Atotech Deutschland GmbH & Co. KG, Berlin, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 5/18 (2006.01); C25D 7/00 (2006.01); H01L 21/48 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/425 (2013.01); C25D 3/38 (2013.01); C25D 5/022 (2013.01); C25D 5/18 (2013.01); C25D 7/00 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H05K 3/423 (2013.01); H05K 3/429 (2013.01); H05K 3/108 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/1492 (2013.01);
Abstract
The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) including microvias filled with copper comprising the steps of: