Bert Reents

Title: Bert Reents: Innovator in High Density Interconnect Technology

Introduction

Bert Reents is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of printed circuit board technology, holding a total of 7 patents. His work primarily focuses on methods that enhance the performance and efficiency of high density interconnect printed circuit boards.

Latest Patents

One of Bert Reents' latest patents is a method of preparing a high density interconnect printed circuit board that includes microvias filled with copper. This invention refers to a process that involves creating high density interconnect printed circuit boards (HDI PCBs) or integrated circuit substrates. The method includes the use of through-holes and grate structures filled with copper, which enhances the electrical performance of the boards.

Career Highlights

Throughout his career, Bert Reents has worked with prominent companies in the electronics industry. Notably, he has been associated with Atotech Deutschland GmbH and Atotech Deutschland GmbH & Co. KG. His experience in these organizations has allowed him to develop and refine his innovative techniques in printed circuit board technology.

Collaborations

Bert Reents has collaborated with several professionals in his field, including Soungsoo Kim and Markus Youkhanis. These collaborations have contributed to the advancement of technology in high density interconnect systems.

Conclusion

Bert Reents is a distinguished inventor whose work in high density interconnect technology has led to significant advancements in printed circuit board design. His contributions continue to influence the industry and pave the way for future innovations.