Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Bert Reents

Soungsoo Kim

Markus Youkhanis

Bernd Roelfs

Horst Brüggmann

Akif Özkök

Marko Mirkovic

Thomas Pliet

Thomas Schiwon

Toshiya Fujiwara

Rene Wenzel

Herwig Josef Berthold

Marcin Klobus

Reinhard Schneider

Sven Lamprecht

Kai-Jens Matejat

Torsten Küssner

Heribert Streup

Tafadzwa Magaya

Mustafa Özkök

Stephan Kenny

Wolfgang Plöse

René Wenzel

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper, which comprises the steps of:

Method of preparing a high density interconnect printed circuit board including microvias filled with copper

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) including microvias filled with copper comprising the steps of:

Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper.

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.

Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

Electrolytic method for filling holes and cavities with metals

A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.

Device and method for electrolytically treating an at least superficially electrically conducting work piece

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Berlin, Germany

Bert Reents