The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Aug. 30, 2005
Bert Reents, Berlin, DE;
Thomas Pliet, Berlin, DE;
Bernd Roelfs, Berlin, DE;
Toshiya Fujiwara, Tokyo, JP;
Rene Wenzel, Berlin, DE;
Markus Youkhanis, Berlin, DE;
Soungsoo Kim, Berlin, DE;
Bert Reents, Berlin, DE;
Thomas Pliet, Berlin, DE;
Bernd Roelfs, Berlin, DE;
Toshiya Fujiwara, Tokyo, JP;
Rene Wenzel, Berlin, DE;
Markus Youkhanis, Berlin, DE;
Soungsoo Kim, Berlin, DE;
Atotech Deutschland GmbH, Berlin, DE;
Abstract
The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.